参数资料
型号: C0402C109D4GAC
厂商: KEMET Corporation
英文描述: CERAMIC CHIP CAPACITORS
中文描述: 陶瓷芯片电容器
文件页数: 8/9页
文件大?。?/td> 1045K
代理商: C0402C109D4GAC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20
°
20
°
Maximum
Typical
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75
±
0.10
(.069
±
0.004)
4.0
±
0.10
(.157
±
0.004)
2.0
±
0.05
(.079
±
0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D
0
P
0
E
P
2
T
1
G
1
G
2
R Min.
8mm
1/2
Pitch
2.0
±
0.10
(.079
±
.004)
See Require-
ments
Section 3.3 (d)
4.0
±
0.10
(0.157
±
.004)
3.5
±
0.05
(.138
±
.002)
8.0
±
0.3
(.315
±
0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P
1
W
F
A
0
B
0
T
8mm
12mm
4.0
±
0.10
(0.157
±
.004)
8.0
±
0.10
(0.315
±
.004)
12mm
Double
Pitch
12.0
±
0.3
(.472
±
.012)
5.5
±
0.05
(.217
±
.002)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A
0
B
0
P
1
P
0
P
2
D
0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±
0.2 (
±
0.008)
Top
Tape
Cover
T
User Direction of Feed
T
1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G
2
R
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相关PDF资料
PDF描述
C0402C109D4PAC CERAMIC CHIP CAPACITORS
C0402C109D4RAC CERAMIC CHIP CAPACITORS
C0402C109D4UAC CERAMIC CHIP CAPACITORS
C0402C109D5GAC CERAMIC CHIP CAPACITORS
C0402C109D5PAC CERAMIC CHIP CAPACITORS
相关代理商/技术参数
参数描述
C0402C109D4GACTU 功能描述:多层陶瓷电容器MLCC - SMD/SMT 16volts 1.0pF C0G 0.5% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C0402C109D4HAC7867 功能描述:CAP CER 0402 1PF 16V ULTRA STABL 制造商:kemet 系列:C 包装:带卷(TR) 零件状态:在售 电容:1pF 容差:±0.5pF 电压 - 额定:16V 温度系数:X8R 工作温度:-55°C ~ 150°C 特性:低 ESL,高温 等级:- 应用:通用 故障率:- 安装类型:表面贴装,MLCC 封装/外壳:0402(1005 公制) 大小/尺寸:0.039" 长 x 0.020" 宽(1.00mm x 0.50mm) 高度 - 安装(最大值):- 厚度(最大值):0.022"(0.55mm) 引线间距:- 标准包装:10,000
C0402C109D4HACAUTO 功能描述:CAP CER 0402 1PF 16V ULTRA STABL 制造商:kemet 系列:C 包装:带卷(TR) 零件状态:在售 电容:1pF 容差:±0.5pF 电压 - 额定:16V 温度系数:X8R 工作温度:-55°C ~ 150°C 特性:低 ESL,高温 等级:AEC-Q200 应用:汽车级 故障率:- 安装类型:表面贴装,MLCC 封装/外壳:0402(1005 公制) 大小/尺寸:0.039" 长 x 0.020" 宽(1.00mm x 0.50mm) 高度 - 安装(最大值):- 厚度(最大值):0.022"(0.55mm) 引线间距:- 标准包装:10,000
C0402C109D4PAC 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS
C0402C109D4RAC 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS
373| 924| 756| 452| 846| 745| 937| 768| 810| 525|